Seppo K. Pienimaa received the M.Sc. degree in material physics, from the University of Oulu, Finland in 1980. Since graduation, he has continued research work with the Microelectronics Laboratory, University of Oulu. In January 1984, he joined Lohja Microelectronics as a researcher for tape automated bonding and wafer bumping processes. In September 1986, he joined Salora/Nokia Mobile Phones as Manager of Electronic Packaging Research, then in 1995 he was a Visiting Researcher with Microelectronics and Computer Technology Corporation (MCC), Austin TX. After that, he became Senior Research Manager of Electronic Packaging Research with Nokia Mobile Phones, Salo, Finland. During 1999 and 2000, he was also part-time Professor with Tampere University of Technology, Finland. After that he focused on product technology concepts with Nokia, Helsinki, Finland. He was also nominated to NMP Fellow in 2003. Currently he is Competence Area Manager for Mechanics and Electronics Integration with Nokia Research Center, Helsinki, Finland. He has several patents and publications.